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- Thermal Adhesive Tape, 25m x 10mm x 0.20mm Do...
Thermal Adhesive Tape, 25m x 10mm x 0.20mm Double Side Thermal Tapes Cooling Heatsink Pad Apply to LED, IGBT IC Chip Computer CPU GPU Modules MOS
TZS 39745
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EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 2.0 W/mK.
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Product Details
- Thermal adhesive tape with high thermal conductivity, insulation, and strong stickiness
- Efficient thermal conductivity of 2.0 W/mK, outperforming generic pads
- Applicable in LED, IGBT IC chip, computer CPU, GPU, and SSD drives
- Strong adhesive strength, suitable for bonding heat sink to microprocessor
- Widely used in LED industry, automotive electronics, power industry, and more
- Dimensions: 10mm x 25m, with a glass fiber thickness of 0.2mm and breakdown voltage of 5KVAC
| Item Weight | 0.2 lbs (90 grams) |
Product Description
Thermal Adhesive Tape, 25m x 10mm x 0.20mm Double Side Thermal Tapes Cooling Heatsink Pad Apply to LED, IGBT IC Chip Computer CPU GPU Modules MOS Tube SSD Drives
Customer Questions & Answers
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Question:
What is the main purpose of Thermal Adhesive Tape?
Answer: Thermal Adhesive Tape is designed to enhance heat dissipation in electronic components by providing a strong adhesive bond. It is ideal for securing heatsinks to CPUs, GPUs, and other heat-sensitive components, ensuring efficient thermal conductivity. In practice, this tape is particularly useful in applications involving LED projects, IGBT modules, or any high-performance electronics where overheating may be an issue. -
Question:
Can this tape be used for materials other than electronics?
Answer: While Thermal Adhesive Tape is primarily formulated for electronic components, it can also be applied in various DIY projects that require heat management. For instance, hobbyists may use it in crafting or automotive repairs where heat-resistant bonding is necessary. Its versatility makes it a handy tool in both tech-savvy and general repair scenarios. -
Question:
How does the thickness of this tape affect its performance?
Answer: The tape measures 0.20mm in thickness, which strikes a balance between flexibility and thermal transfer efficiency. Thinner tape may conform better to uneven surfaces, while thicker options might offer added durability. Hence, choosing the right thickness is crucial depending on the application—this tape can adapt to both flat and complex geometries in electronic assemblies. -
Question:
Is this tape suitable for high-temperature applications?
Answer: Yes, this Thermal Adhesive Tape is crafted to withstand high temperatures, making it suitable for applications involving high-heat components like CPUs and GPUs. This quality ensures that the adhesive maintains its integrity and thermal conductivity even under stress, preventing thermal failures in critical electronics, such as in gaming PCs or industrial machinery. -
Question:
How do I apply the Thermal Adhesive Tape correctly?
Answer: To apply the tape, start by cleaning the surfaces where the tape will be attached to ensure optimal adhesion. Cut the tape to the necessary length, then carefully place it on the component or the heatsink. Press down firmly to secure a bond, ensuring there are no air bubbles. This application technique maximizes both adhesion and heat transfer, vital for electronic performance. -
Question:
What types of surfaces can this tape adhere to?
Answer: This tape effectively adheres to a variety of surfaces, including metals, plastics, and ceramics, making it ideal for securing heatsinks to various electronic components. This versatility allows it to cater to different assembly scenarios, such as attaching MOS tubes or IC chips in diverse electronic devices, ensuring optimal performance across multiple materials. -
Question:
Can I remove the tape once applied?
Answer: Yes, while Thermal Adhesive Tape provides a strong bond, it can be removed if necessary. However, some adhesive residue may remain on the surfaces, which can typically be cleaned off with suitable solvents. This property allows for adjustments in electronic setups, such as upgrading heatsinks or replacing components without damaging them. -
Question:
What is the width of this tape and why is it important?
Answer: The tape is 10mm wide, offering a substantial surface area for optimal adhesion between components and heatsinks. This width helps maintain a reliable bond even under thermal cycling and vibrations. Adequate width is important to prevent any gaps that could lead to thermal issues, ensuring that the heat dissipates efficiently, thereby enhancing the overall performance of electronic devices. -
Question:
How can this tape improve my electronic device's performance?
Answer: Using Thermal Adhesive Tape allows for better heat transfer between components and their cooling solutions, thus preventing overheating and potential damage. By securing heatsinks more effectively, the tape ensures that your CPU or GPU remains cooler during intensive tasks, ultimately enhancing performance in gaming, computational tasks, or any heat-sensitive applications. -
Question:
Where can I buy Thermal Adhesive Tape in Tanzania?
Answer: You can purchase Thermal Adhesive Tape, 25m x 10mm x 0.20mm at Ubuy. They offer a reliable selection of thermal adhesive products, making it easy to find what you need for your projects or repairs. With Ubuy’s comprehensive range, access to quality thermal adhesives is at your fingertips in Tanzania.
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TZS 39745
This product is not Fulfilled by Ubuy and can take minimum 10 days in delivery. We might cancel the product from the order and refund you if any issue arise with the delivery of this product.
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
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Features & Benefits
- Thermal Pad with high thermal conductivity
- Outperforms generic and performance pads
- Thermal Conductivity of 2.0 W/mK
- Widely used in most electronic devices
- High tensile strength and strong adhesion
- Achieves effective thermal dissipation
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